Intel Corp introduces Intel CentrinoT mobile technology
By Our Convergence Bureau | 13 Mar 2003
Bangalore:
Intel
Corporation (www.intel.com)
has introduced Intel CentrinoT mobile technology, integrating
wireless capability into a new generation of mobile PCs
that will bring business users and consumers greater freedom
to connect in new places and in new ways.
Representing Intels best technology for mobile PCs, Intel Centrino mobile technology includes a new mobile processor, related chipsets and 802.11 wireless network functions that have been optimised, tested and validated to work together. In addition to wireless communications, Intel Centrino mobile technology includes features designed to enable extended battery life, thinner and lighter notebook designs, and outstanding mobile performance.
Unwiring the PC will fundamentally change the way people use computers, allowing them to communicate, be productive or be entertained wherever and whenever they want, says Avtar Saini, director, South Asia, Intel Asia Electronics.
Our focus on integrating all the elements of mobility allows Intel Centrino mobile technology to deliver an outstanding wireless computing experience and marks the first time weve put a combination of technologies under a single brand. This breakthrough innovation, together with industry-wide investment and WiFi hotspot deployments, brings computing and communications capabilities to businesses and consumers, adding new value to mobile PCs, he adds.
Intel Centrino mobile technology-based notebook PCs are available immediately from leading computer makers worldwide. System pricing will start as low as $1,399, comparable to todays mainstream notebooks. Computer shoppers can identify these notebooks by a Centrino brand logo featuring a striking magenta colour and the Intel Inside mark.
Latest articles
Featured articles
The analog antidote: perception, reality, and the "Windows crisis" narrative
By Cygnus | 17 Feb 2026
Viral claims of a Windows collapse contrast with market data showing a slower shift as enterprises weigh AI, hardware costs, and legacy systems.
The analog antidote: why Americans are trading algorithms for physical media
By Cygnus | 16 Feb 2026
Vinyl, books, and DVDs are seeing renewed interest as Americans seek ownership, focus, and a break from screen fatigue in an increasingly digital world.
China opens market to 53 African nations in zero-tariff pivot
By Cygnus | 16 Feb 2026
China will grant zero-tariff access to 53 African nations from May 2026, reshaping global trade ties and deepening economic links across the Global South.
The deregulation “holy grail”: Trump EPA dismantles the legal bedrock of climate policy
By Cygnus | 13 Feb 2026
The Trump EPA moves to rescind the 2009 Endangerment Finding, reshaping federal climate authority and business risk.
Tokenising the gilt: what the UK’s digital bond pilot could mean for sovereign debt
By Cygnus | 12 Feb 2026
HM Treasury selects HSBC Orion and Ashurst LLP for its Digital Gilt Instrument (DIGIT) pilot. A deep dive into the architecture, legal framework, and the shift toward near real-time settlement.
The silicon-rich AI race: how Cisco’s G300 puts networking at the center of compute
By Cygnus | 11 Feb 2026
Cisco's new Silicon One G300 targets AI data center bottlenecks as networking becomes central to compute performance.
Server CPU Shortages Grip China as AI Boom Strains Intel and AMD Supply Chains
By Cygnus | 06 Feb 2026
Intel and AMD server CPU shortages are hitting China as AI data center demand surges, pushing lead times to six months and driving prices higher.
Budget 2026-27 Seeks Fiscal Balance Amid Rupee Volatility and Industrial Stagnation
By Cygnus | 02 Feb 2026
India's Budget 2026-27 targets fiscal discipline with record capex as markets tumble, the rupee weakens and manufacturing struggles to regain momentum.
The Thirsty Cloud: Why 2026 Is the Year AI Bottlenecks Shift From Chips to Water
By Axel Miller | 28 Jan 2026
As AI server density surges in 2026, data centers face a new bottleneck deeper than chips — the massive water demand required for cooling next-generation infrastructure.

