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Via Tech.''s chipset to shrink ultra mobile PCs by 40 per centnews
07 July 2006
Via Technologies Inc. has launched a new chipset that, it says, will help reduce the size of ultra mobile PCs by as much as 40 per cent. According to the company, its new VX700 chipset works with the company's own Via C7-M microprocessors aimed at small devices.

A chipset is the pair of chips that regulate the flow of data from the microprocessor to other chips inside a device, such as memory and graphics chips.

Via, in a statement, said that it has slimmed down the size of its new VX700 chipset by integrating the north and south bridges of the set into a single package measuring 35 mm by 35 mm. It also said that the chipsets will be available in mass quantities late in the third quarter. Via did not disclose pricing.

Microsoft Corp. launched the ultra mobile PC concept earlier this year. Originally dubbed Origami, the devices were designed to contain the power of a full PC in a gadget small enough to be carried in a pocket, purse or backpack. Via's chipsets, coupled with its C7-M microprocessor, are designed to reduce power consumption and save battery life in ultra mobile PCs, Via said.

Meanwhile, DualCor Technologies Inc., based in Scotts Valley, California, has said that it has used the VX700 chipset and the C7-M microprocessor to create a new device that adds mobile phone functionality to an ultra mobile PC. The company however did not say when the device would be launched.

 


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Via Tech.''s chipset to shrink ultra mobile PCs by 40 per cent